20

Electropotential-stimulated wear of copper during chemical mechanical planarization

Year:
2007
Language:
english
File:
PDF, 543 KB
english, 2007
23

Role of Surfactant Molecules in Post-CMP Cleaning

Year:
2008
Language:
english
File:
PDF, 576 KB
english, 2008
24

Key observations of cumene hydroperoxide concentration on runaway reaction parameters

Year:
2010
Language:
english
File:
PDF, 649 KB
english, 2010
27

Comparison of Interfacial Forces During Post-Chemical-Mechanical-Polishing Cleaning

Year:
2008
Language:
english
File:
PDF, 337 KB
english, 2008